The main materials of wafer cassettes are as follows:
Plastics
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PPS (Polyphenylene Sulfide):
- Characteristics: It has high mechanical strength, high temperature resistance, corrosion resistance, and good flame retardancy. It can still maintain good dimensional stability at high temperatures and is not easily deformed.
- Application scenarios: Widely used in wafer storage and transportation during the semiconductor manufacturing process, effectively protecting wafers from the influence of the external environment.
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PC (Polycarbonate):
- Characteristics: It has good transparency, impact resistance, and dimensional stability. It has a relatively high hardness and can withstand a certain degree of external impact without breaking.
- Application scenarios: In some occasions where transparency of the wafer cassette is required, such as when it is convenient to observe the wafer state. At the same time, it is also suitable for general wafer storage and transportation.
Metals
- Aluminum alloy:
- Characteristics: Lightweight, high strength, good thermal conductivity and electrical conductivity. The surface can be treated with anodic oxidation to improve corrosion resistance.
- Application scenarios: In some special semiconductor manufacturing environments, such as when electromagnetic shielding is required or there is a high demand for heat dissipation, aluminum alloy wafer cassettes can play a role.
Composite Materials
- Carbon fiber reinforced plastic:
- Characteristics: It combines the high strength of carbon fiber and the plasticity of plastic. It has the advantages of light weight, high strength, corrosion resistance, and antistatic properties.
- Application scenarios: Suitable for high-end semiconductor manufacturing fields where extremely high performance requirements are placed on wafer cassettes, and it can meet strict cleanliness and mechanical performance requirements.
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We support customizing various types of wafer cassettes. If you need them, please contact us in the following ways. Thank you.
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